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High Temperature Standard Jedec Tray IC Packaging

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High Temperature Standard Jedec Tray IC Packaging

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Brand Name : Hiner-pack

Model Number : HN1809

Certification : ISO 9001 ROHS SGS

Place of Origin : Made In China

MOQ : 1000 pcs

Price : $1.35~$2.38(Prices are determined according to different incoterms and quantities)

Payment Terms : T/T

Supply Ability : The capacity is between 2500PCS~3000PCS/per day

Delivery Time : 5~8 working days

Packaging Details : 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Material : PPE

Color : Black

Temperature : 150°C

Property : ESD

Surface resistance : 1.0x10E4~1.0x10E11Ω

Flatness : less than 0.76mm

Clean Class : General and ultrasonic cleaning

Incoterms : EXW,FOB,CIF,DDU,DDP

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High Temperature Standard Jedec Tray IC Packaging
High Temperature Standard Black Matrix Trays Can Be Used For Loading Sensor IC

The tray has a 45-degree chamfer to provide the visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes and maximize the protection of the chip.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

Product Advantage
1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japen...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

Product Application

Electronic component Semiconductor Embedded System Display technology

Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply


Reference to temperature resistance of different materials

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

Outline Line Size 322.6*135.9*7.62mm Brand Hiner-pack
Model HN 1809 Package Type IC
Cavity Size 19.0*6.0*2.2 mm Matrix QTY 11*12=132PCS
Material PPE Flatness MAX 0.76mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

High Temperature Standard Jedec Tray IC Packaging

FAQ

Q1: Are you a manufacturer?
Ans: Yes, We have ISO 9000 Quality Management System.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?
Ans: Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?
Ans: Normally 5-8days or so.

Q5: Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

High Temperature Standard Jedec Tray IC Packaging


Product Tags:

Jedec Conductive Tray

      

ESD Conductive Tray

      

ODM esd component tray

      
Quality High Temperature Standard Jedec Tray IC Packaging for sale

High Temperature Standard Jedec Tray IC Packaging Images

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